May 15, 2024 -- Automotive Grade Linux (AGL), a collaborative cross-industry effort developing an open source platform for ...
Designed to bridge the gap between CAN FD and 100Mbit Ethernet, the DCAN-XL sets a new standard in high-speed, reliable data ...
Andes, HiRain, and HPMicro jointly announced that the three parties will cooperate to combine the AndesCoreTM RISC-V ...
Frontgrade Gaisler is designing a new RISC-V processor tailored to meet the requirements of microcontrollers for the space ...
Intel Corporation today announced the appointment of Kevin O’Buckley as senior vice president and general manager of Foundry ...
ADTechnology announces a collaboration with US semiconductor IP specialist ANAFLASH at the Embedded Vision Summit in California, USA, 21-23 May.
Sondrel (AIM: SND), a leading provider of ultra-complex custom chips for leading global technology brands, is pleased to ...
Real Intent today announced that lowRISC C.I.C., the open silicon ecosystem organization, is deploying Real Intent Ascent Lint, Meridian CDC, and Meridian RDC static sign-off tools for the OpenTitan ...
SureCore, the ultra-low power embedded memory specialist, has announced the successful tape out of the next key part of the ...
May 14, 2024-- M31 Technology Corporation (M31), a leading global provider of silicon intellectual property (IP), announced ...
NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash and DRAM memory, today announced a performance boosting Floating Body Cell Mechanism for 3D X-DRAM.
Ceva today announced its financial results for the first quarter ended March 31, 2024. Financial results for the first ...